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EXAMPLE STENCIL DESIGN

8X (.061 )

[1.55]

8X (.024)

[0.6]

6X (.050 )

[1.27]

(.213)

[5.4]

(R.002 ) TYP

[0.05]

8X (.055)

[1.4]

8X (.024)

[0.6]

6X (.050 )

[1.27]

(.217)

[5.5]

(R.002 )

[0.05]

TYP

SOIC - 1.75 mm max height

D0008B

SMALL OUTLINE INTEGRATED CIRCUIT

4221445/C 02/2019

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

9. Board assembly site may have different recommendations for stencil design.

HV / ISOLATION OPTION

.162 [4.1] CLEARANCE / CREEPAGE

BASED ON .005 INCH [0.127 MM] THICK STENCIL

SOLDER PASTE EXAMPLE

SCALE:6X

SYMM

SYMM

1

4

5

8

IPC-7351 NOMINAL

.150 [3.85] CLEARANCE / CREEPAGE

SYMM

SYMM

1

4

5

8

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ISO7710

SLLSER9E – NOVEMBER 2016 – REVISED DECEMBER 2024

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