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L99VR03 Folha de dados(PDF) 14 Page - STMicroelectronics |
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L99VR03 Folha de dados(HTML) 14 Page - STMicroelectronics |
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14 / 28 page ![]() 4 Package and PCB thermal data 4.1 VFDFN8 thermal data Figure 21. VFDFN8 PC board Cu coverage on top layer: 90% Cu on mid1 layer: full coverage Cu on mid2 layer: full coverage Cu coverage on bottom layer: 90% • Board finish thickness 1.6 mm ±10% • Board four layers • Board dimension 77 x 86 mm • Board Material FR4 • Cu thickness 0.070 mm (outer layers) • Cu thickness 0.035 mm (inner layers) • Thermal vias separation 1.2 mm • Thermal via diameter 0.3 mm ±0.08 mm • Cu thickness on vias 0.025 mm • Footprint dimension 1.5 x 1.3 mm L99VR03 Package andPCB thermal data DS14803 - Rev 2 page 14/28 |
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