Panasonic Industry Co., Ltd. Electromechanical Control Business Division

industrial.panasonic.com/ac/e/

ASCTB14E 202405

Panasonic Industry Co., Ltd. 2024

Signal Relays ( 2 A or less ) TQ RELAYS

■ For cautions for use, please read " Relay Soldering and Cleaning Guidelines " and " SMT Soldering

Guidelines ".

■ PC board terminal

In case of hand soldering, the following conditions should be observed.

The effect on the relay depends on the PC board used. Please verify the actual PC board to be used.

● Automatic soldering ( Flow )

Recommended

conditions

Temperature

Time

Measurement

location

Preheating

Max. 120 ℃

Within

120 seconds

Solder surface

terminal

Soldering

260 ℃ ±5 ℃

Within

6 seconds

Solder

temperature

● Hand soldering

Recommended

conditions

Temperature

Time

Measurement

location

Soldering

Max. 350 ℃

Within

3 seconds

Tip

temperature

■ Surface-mount terminal

In case of automatic soldering ( reflow ), the following conditions should be observed.

● IRS ( infrared reflow soldering method ) heating conditions

Recommend conditions

Number of reflow

1 time

Measuring position

Surface of PC board where relay is mounted.

● Mounting cautions

Cautions to observe when mounting temperature

increases in the relay are greatly dependent on the way

different parts are located a PC board and the heating

method of the reflow device. Therefore, please conduct

testing on the actual device beforehand after making sure

the parts soldered on the relay terminals and the top of

the relay case are within the temperature conditions.

Measuring position of temperature profile

■ Other things to observe

• Exceeding the stipulated conditions when soldering may

affect coaxial switch performance. Be sure to consult us

beforehand.

• Since thermal stress on a relay will depend on the PC

board and process conditions, please be sure to test using

the actual PC board.

• Creep-up, wettability and solder strength will differ

depending on changes in the mounting conditions and

type of solder. Please evaluate based on actual production

conditions.

• Only apply coating after the relay has returned to room

temperature.

EXAMPLE OF RECOMMENDED SOLDERING CONDITIONS

T3

T2

T1

t1=60s to 120s

t2=within 20s

t3=within 30s

t4=within 10s（245 to 250°C）

T1=150 to 180°C

T2=230°C and higher

T3=250°C max

t1

t3

t2

t4

Note

Note：

indicates the pad temperature. In

some cases, the ambient

temperature may be greatly

mounting condition.

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