5.4 Thermal Information

THERMAL METRIC(1)

AMC3301

UNIT

DWE (SOIC)

16 PINS

RθJA

Junction-to-ambient thermal resistance

73.5

°C/W

RθJC(top) Junction-to-case (top) thermal resistance

31

°C/W

RθJB

Junction-to-board thermal resistance

44

°C/W

ψJT

Junction-to-top characterization parameter

16.7

°C/W

ψJB

Junction-to-board characterization parameter

42.8

°C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

5.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

PD

Maximum power dissipation

VDD = 5.5 V

231

mW

VDD = 3.6 V

151

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AMC3301

SBAS917C – AUGUST 2019 – REVISED MAY 2025

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