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TS4990 Folha de dados(PDF) 29 Page - STMicroelectronics |
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TS4990 Folha de dados(HTML) 29 Page - STMicroelectronics |
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29 / 33 page ![]() DocID9309 Rev 14 29/33 TS4990 Package information 33 5.3 DFN8 package information Note: DFN8 exposed pad (E2 x D2) is connected to pin number 7. For enhanced thermal performance, the exposed pad must be soldered to a copper area on the PCB, acting as a heatsink. This copper area can be electrically connected to pin7 or left floating. Figure 72. DFN8 3x3x0.90 mm package mechanical drawing (pitch 0.5 mm) Table 9. DFN8 3x3x0.90 mm package mechanical data (pitch 0.5 mm) Ref. Dimensions Millimeters Mils Min. Typ. Max. Min. Typ. Max. A 0.80 0.90 1.00 31.5 35.4 39.4 A1 0.02 0.05 0.8 2.0 A2 0.55 0.65 0.80 217 25.6 31.5 A3 0.20 7.9 b 0.18 0.25 0.30 7.1 9.8 11.8 D 2.85 3.00 3.15 112.2 118.1 124 D2 2.20 2.70 86.6 106.3 E 2.85 3.00 3.15 112.2 118.1 124 E2 1.40 1.75 55.1 68.9 e 0.50 19.7 L 0.30 0.40 0.50 11.8 15.7 19.7 ddd 0.08 3.1 D D2 e C PLANE SEATING BOTTOM VIEW b 5 8 1 23 4 6 7 0.15x45° 7426334_F |
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