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LMH6624-MIL

SNOSD63 – JUNE 2017

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(1)

Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150°C.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN differential

±1.2

V

Supply voltage (V+ – V–)

13.2

V

Voltage at input pins

V+ +0.5,

V– –0.5

V

Input current

±10

mA

Soldering information

Infrared or convection (20 s)

235

°C

Wave soldering (10 s)

260

°C

Junction temperature(2)

150

°C

Storage temperature

–65

150

°C

(1)

Human body model, 1.5 k

Ω in series with 100 pF. JEDEC document JEP155 states that 2000-V HBM allows safe manufacturing with a

standard ESD control process. Manufacturing with less than 2000-V HBM is possible with the necessary precautions. Pins listed as

±2000 V may actually have higher performance.

(2)

Machine model, 0

Ω in series with 200 pF. JEDEC document JEP157 states that 200-V MM allows safe manufacturing with a standard

ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Machine model(2)

±200

(1)

Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150°C.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Operating temperature(2)

–40

+125

°C

Operating supply voltage (V+ – V–)

±2.25

±6.3

V

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) – TA)/ RθJA . All numbers apply for packages soldered directly onto a PC board.

6.4 Thermal Information

THERMAL METRIC(1)

LMH6624-MIL

UNIT

DBV

D

5 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance(2)

265

166

°C/W