TFS7705H datasheet(13/42 Pages) POWERINT

13 / 42 page

Rev. B 04/15

TFS7701-7708

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shunt regulator, which will be enabled if the BYPASS pin voltage

is externally driven above 5.7 V. The BYPASS pin shunt current

is used for two functions:

1. First, a 4 mA threshold (I

BP(ON)) for main remote-on. When the

BYPASS pin current exceeds this threshold, the main is

enabled.

2. Second a 15 mA threshold (I

BP(SD))for standby secondary OVP

latch-off. When the BYPASS pin current exceeds this

threshold, the standby and main converters are latched-off.

This latch can be reset by pulling the LINE-SENSE pin below

the line undervoltage threshold (I

L(SB-UVOFF)), or by discharging

the BYPASS pin below 4.7 V.

Main and Standby Line Overvoltage Detection (OV)

The overvoltage threshold is included in the device, and can be

used to disable the device during overvoltage (with the use of

an additional external signal Zener). The overvoltage threshold

is set sufficiently high to prevent accidental triggering during

boost PFC overshoot conditions. When the overvoltage

condition is triggered, it will simultaneously shutdown both the

main and standby. The overvoltage feature is intended for use

with external components (circuitry), to program the overvoltage

threshold independently of the undervoltage thresholds (see the

Applications section for details).

High-Power eSIP Package

The HiperTFS-2 package is designed to minimize the physical

size of the device, while maintaining a low thermal resistance

and sufficient electrical spacing for the pins. The package has

12 functional pins with 4 pins removed for increased pin-to-pin

spacing between high-voltage pins. The low-side two-switch

forward and flyback MOSFETs have a thermal resistance of less

than 1 °C/W to the exposed pad on the back of the package.

Since this pad is referenced to the SOURCE pin (Source), it is at

electrical ground potential and thus can be connected to the

heat sink without need for electrical insulation. The high-side

MOSFET is over-molded to achieve electrical isolation and thus

also allows direct connection to the heat sink.

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