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ABSOLUTE MAXIMUM RATINGS

(1)

PIN ASSIGNMENTS

1

2

3

4

8

7

6

5

E/D(Enable/Disable)

V+

OUT

StatusFlag

E/DCom(Enable/DisableCommon)

-IN

+IN

V-

PowerPAD

HeatSink

(Locatedon

bottomside)

(1)

V-

NC

(3)

NC

(3)

V-

+IN

NC

(3)

-IN

NC

(3)

E/DCom(Enable/DisableCommon)

V-

V-

NC

(3)

NC

(3)

StatusFlag

V

OUT

V+

NC

(3)

NC

(3)

E/D(Enable/Disable)

V-

1

2

3

4

5

6

7

8

9

10

20

19

18

17

16

15

14

13

12

11

PowerPAD

HeatSink

(Locatedon

topside)

(2)

OPA454

SBOS391 – DECEMBER 2007

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PRODUCT

PACKAGE-LEAD

PACKAGE DESIGNATOR

PACKAGE MARKING

OPA454

SO-8

DDA

OPA454

OPA454

DWD

OPA454

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Available Q2, 2008.

OPA454

UNIT

Supply Voltage

120

V

(V–) – 0.3 to (V+) + 0.3

V

±10

mA

E/D to E/D Com Voltage

+5.5

V

Continuous

Operating Temperature

–55 to +125

°C

Storage Temperature

–55 to +125

°C

Junction Temperature

+150

°C

Human Body Model (HBM)

4000

V

ESD Rating:

Charged Device Model (CDM)

500

V

Machine Model (MM)

150

V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2)

Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails should

be current limited to 10mA or less.

(3)

Short-circuit to ground.

DDA PACKAGE

DWD PACKAGE(1)

SO-8 PowerPAD

HSOP-20 PowerPAD

(TOP VIEW)

(TOP VIEW)

(1)

PowerPAD is internally connected to V–.

Soldering the PowerPAD to the PCB is

always required, even with applications that

have low power dissipation.

(1)

Available Q2, 2008.

(2)

PowerPAD is internally connected to V–.

(3)

NC = No internal connection

2

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Product Folder Link(s): OPA454