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●Instructions of pattern layouts

2. Please mount each external component as close to the IC as possible.

3. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit

impedance.

4. Make sure that the PCB GND traces are as thick as possible, as variations in ground potential caused by high ground

currents at the time of switching may result in instability of the IC.

5. This series’ internal driver transistors bring on heat because of the output current and ON resistance of driver transistors.

■NOTE ON USE (Continued)