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SN260 Folha de dados(PDF) 84 Page - STMicroelectronics

Nome de Peças SN260
Descrição Electrónicos  ZigBee® 802.15.4 network processor
PDF  88 Pages
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Fabricante Electrônico  STMICROELECTRONICS [STMicroelectronics]
Página de início  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

SN260 Folha de dados(HTML) 84 Page - STMicroelectronics

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Mechanical details
SN260
84/88
10
Mechanical details
The SN260 package is a plastic 40-pin QFN that is 6mm x 6mm x 0.9mm. A large ground
pad in the bottom center of the package forms an extra 41st pin. A number of thermal vias
should connect the SN260 decal center to a PCB ground plane. For more information, refer
to www.stmcu.com.
Figure 13 illustrates the package drawing.
Figure 13.
Package drawing
Top View
Edge View
Sym.
Minimum
Nominal
Maximum
A0.85
1.90
1.0
Common Dimensions
(mm)
Tolerances for
Form&Position
Sym.
bbb
aaa
0.10
0.15
Notes
Notes
1. JEDECref MO
-220
2. All dimensions are in millimeters
3. Pin1
orientation identified by chamfer on corner of
exposed die pad
.
4.
DatumCand the seating plane are defined by the flat surface
of the metallised terminal
5. Dimension'e' represents the terminal pitch
6.
Dimension b applies to metallised terminal and is measured
1. 25to1.30 mmfromterminal tip
.
7. Dimension L1
represents terminal pull back frompackage
edge. Where terminal pull back exists
, only upper half of lead is
visible on package edge due to half etching of leadframe
.
8.
Package surface shall be matte finish
, Ra1.6- 2.2
9. Package warp shall be
1. 150 maximum
10. Leadframe material is copper A
194.
11.
Coplanarity applies to the exposed pad as well as the
terminals.
Detail B
BottomView
2x
2x
Nx
ccc
0.10
Detail A
Detail B
Detail A
Pin1
EXPOSED
PAD
7
0.4000
0.4000
A1
0
1.02
1.05
A3
0. 20ref
D
5.90
6.11
6.10
D1
4.5BSC
D2
4.21
4.31
4.41
E
5.91
6.10
6.10
E1
E2
4.21
4.31
4.41
L
0.35
0.41
1.45
L1
0.1
b
0.18
1.23
0.31
N40
e0.50
k1.2
Rb min/2
T0.15
R
4
6
3
D
EE1 E2
D1
D2
e
Nx b
0. 15typ
L1
4.5BSC



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