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SMB15F20A Folha de dados(PDF) 9 Page - STMicroelectronics |
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SMB15F20A Folha de dados(HTML) 9 Page - STMicroelectronics |
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9 / 13 page ![]() 2.2 Reflow profile Figure 20. ST ECOPACK recommended soldering reflow profile for PCB mounting 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 -6 °C/s 240-245 °C 2 - 3 °C/s Temperature (°C) -2 °C/s -3 °C/s Time (s) 0.9 °C/s 60 sec (90 max) Note: Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. SMB15FxxA Reflow profile DS13415 - Rev 1 page 9/13 |
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