INA337, INA338

2

SBOS222A

www.ti.com

SPECIFIED

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE-LEAD

DESIGNATOR(1)

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

INA337

MSOP-8

DGK

–40

°C to +125°C

BIM

INA337AIDGKT

Tape and Reel, 250

"

"""

"

INA337AIDGKR

Tape and Reel, 2500

INA338

MSOP-10

DGS

–40

°C to +125°C

BIL

INA338AIDGST

Tape and Reel, 250

"

"""

"

INA338AIDGSR

Tape and Reel, 2500

NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.

PACKAGE/ORDERING INFORMATION

ABSOLUTE MAXIMUM RATINGS(1)

Supply Voltage .................................................................................. +5.5V

Signal Input Terminals: Voltage(2) ......................................... –0.5V to (V+) + 0.5V

Current(2) ........................................................................

±10mA

Output Short-Circuit ................................................................. Continuous

Operating Temperature Range ....................................... –40

°C to +150°C

Storage Temperature Range .......................................... –65

°C to +150°C

Junction Temperature .................................................................... +150

°C

Lead Temperature (soldering, 10s) ............................................... +300

°C

NOTES: (1) Stresses above these ratings may cause permanent damage.

Exposure to absolute maximum conditions for extended periods may degrade

device reliability. These are stress ratings only, and functional operation of the

device at these or any other conditions beyond those specified is not implied.

(2) Input terminals are diode clamped to the power-supply rails. Input signals that

can swing more than 0.5V beyond the supply rails should be current limited to

10mA or less.

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper han-

dling and installation procedures can cause damage.

ESD damage can range from subtle performance degrada-

tion to complete device failure. Precision integrated circuits

may be more susceptible to damage because very small

parametric changes could cause the device not to meet its

published specifications.

1

2

3

4

8

7

6

5

R

1

V+

V

O

R

2

R

1

V

IN–

V

IN+

V–

INA337

MSOP-8

1

2

3

4

5

10

9

8

7

6

R

1

V+

V

O

R

2

Enable

R

1

V

IN–

V

IN+

V–

(Connect to V+)

INA338

MSOP-10

Top View

PIN CONFIGURATION