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ADPL42002ACPZN5.0-R7 Folha de dados(PDF) 8 Page - Analog Devices

Nome de Peças ADPL42002ACPZN5.0-R7
Descrição Electrónicos  20V, 200mA, Low Noise, CMOS LDO Linear Regulator
PDF  22 Pages
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Fabricante Electrônico  AD [Analog Devices]
Página de início  http://www.analog.com
Logo AD - Analog Devices

ADPL42002ACPZN5.0-R7 Folha de dados(HTML) 8 Page - Analog Devices

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Data Sheet
ADPL42002
analog.com
Rev. 1
8 of 22
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 3. 6-Lead LFCSP Pin Configuration
Figure 4. 8-Lead SOIC Pin Configuration
Pin Descriptions
Table 5. Pin Descriptions
PIN
NAME
DESCRIPTION
6-Lead
LFCSP
8-Lead
SOIC
1
1, 2
VOUT
Regulated Output Voltage. Bypass VOUT to GND with a 2.2µF or greater
capacitor.
2
3
SENSE/ADJ
Sense Input (SENSE). Connect to load. An external resistor divider may also
set the output voltage higher than the fixed output voltage (ADJ).
3
4
GND
Ground.
4
5
EN
The Enable Pin Controls the operation of the LDO. Drive EN high to turn on
the regulator. Drive EN low to turn off the regulator. For automatic startup,
connect EN to VIN.
5
6
SS
Soft Start. An external capacitor connected to this pin determines the soft-
start time. Leave this pin open for a typical 380μs start-up time. Do not
ground this pin. 400µs is a typical soft-start time in the rest of DS.
6
7, 8
VIN
Regulator Input Supply. Bypass VIN to GND with a 2.2µF or greater capacitor.
EP
Exposed Pad. The exposed pad on the bottom of the package enhances
thermal performance and is electrically connected to GND inside the
package. It is recommended that the exposed pad connect to the ground
plane on the board.
3
GND
1
VOUT
2
SENSE/ADJ
4 EN
6 VIN
5 SS
ADPL42002
TOP VIEW
(Not to Scale)
EXPOSED PAD
NOTES
1. EXPOSED PAD. THE EXPOSED PAD ON THE BOTTOM OF
THE PACKAGE ENHANCES THERMAL PERFORMANCE
AND IS ELECTRICALLY CONNECTED TO GND INSIDE THE
PACKAGE. IT IS RECOMMENDED THAT THE EXPOSED
PAD CONNECT TO THE GROUND PLANE ON THE BOARD.
TOP VIEW
(Not to Scale)
VOUT 1
VOUT 2
SENSE/ADJ 3
GND 4
VIN
8
VIN
7
SS
6
EN
5
NOTES
1. EXPOSED PAD. THE EXPOSED PAD ON THE BOTTOM OF
THE PACKAGE ENHANCES THERMAL PERFORMANCE
AND IS ELECTRICALLY CONNECTED TO GND INSIDE THE
PACKAGE. IT IS RECOMMENDED THAT THE EXPOSED
PAD CONNECT TO THE GROUND PLANE ON THE BOARD.
ADPL42002
EXPOSED PAD



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