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ISL71841SEHL/PROTO Folha de dados(PDF) 30 Page - Renesas Technology Corp

Nome de Peças ISL71841SEHL/PROTO
Descrição Electrónicos  Radiation Hardened 30V 32-Channel Analog Multiplexer
PDF  31 Pages
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Fabricante Electrônico  RENESAS [Renesas Technology Corp]
Página de início  http://www.renesas.com
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ISL71841SEHL/PROTO Folha de dados(HTML) 30 Page - Renesas Technology Corp

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ISL71841SEH
FN8735 Rev. 8.00
Page 30 of 30
Aug 10, 2023
For the most recent package outline drawing, see J44.A.
D
j x 45o
D3
B
h x 45o
A
A1
E
L
L3
e
B3
L1
D2
D1
e1
E2
E1
L2
PLANE 2
PLANE 1
E3
B2
0.010
E H
S
S
0.010
E F
S
S
-E-
0.007
E F
M
S HS
B1
-H-
-F-
J44.A MIL-STD-1835 CQCC1-N44 (C-5)
44 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.064
0.120
1.63
3.05
6, 7
A1
0.054
0.088
1.37
2.24
-
B
0.033
0.039
0.84
0.99
4
B1
0.022
0.028
0.56
0.71
2, 4
B2
0.072 REF
1.83 REF
-
B3
0.006
0.022
0.15
0.56
-
D
0.640
0.662
16.26
16.81
-
D1
0.500 BSC
12.70 BSC
-
D2
0.250 BSC
6.35 BSC
-
D3
-
0.662
-
16.81
2
E
0.640
0.662
16.26
16.81
-
E1
0.500 BSC
12.70 BSC
-
E2
0.250 BSC
6.35 BSC
-
E3
-
0.662
-
16.81
2
e
0.050 BSC
1.27 BSC
-
e1
0.015
-
0.38
-
2
h
0.040 REF
1.02 REF
5
j
0.020 REF
0.51 REF
5
L
0.045
0.055
1.14
1.40
-
L1
0.045
0.055
1.14
1.40
-
L2
0.075
0.095
1.90
2.41
-
L3
0.003
0.015
0.08
0.38
-
ND
11
11
3
NE
11
11
3
N44
44
3
Rev. 0 5/18/94
NOTES:
12. Metallized castellations shall be connected to plane 1 terminals
and extend toward plane 2 across at least two layers of ceramic
or completely across all of the ceramic layers to make electrical
connection with the optional plane 2 terminals.
13. Unless otherwise specified, a minimum clearance of 0.015 inch
(0.38mm) shall be maintained between all metallized features
(e.g., lid, castellations, terminals, thermal pads, etc.)
14. Symbol “N” is the maximum number of terminals. Symbols “ND”
and “NE” are the number of terminals along the sides of length
“D” and “E”, respectively.
15. The required plane 1 terminals and optional plane 2 terminals (if
used) shall be electrically connected.
16. The corner shape (square, notch, radius, etc.) may vary at the
manufacturer’s option, from that shown on the drawing.
17. Chip carriers shall be constructed of a minimum of two ceramic
layers.
18. Dimension “A” controls the overall package thickness. The maxi-
mum “A” dimension is package height before being solder dipped.
19. Dimensioning and tolerancing per ANSI Y14.5M-1982.
20. Controlling dimension: INCH.



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