6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range, all the voltages ratings are specified with respect to REF_GND pin voltage (unless

otherwise noted) (1)

MIN

MAX

UNIT

Voltage

VDD, OP_STBL,

–0.3

18

V

T-set, NC

–0.3

6

V

REF_Z

–0.3

10

V

HEATP

–0.3

48

V

HEATM

–42

0.3

V

HEATP - HEATM

0

42

Output short circuit current

ISC

30

mA

Operating temperature range TA

–55

125

°C

Storage temperature range

Tstg

–65

170

°C

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied. These are stress ratings only and functional operation of the device at these or any other conditions

beyond those specified in the Electrical Characteristics Table is not implied.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,

all pins (1)

±2000

V

Charged device model (CDM), per JEDEC specification

JESD22-C101, all pins (2)

±750

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

6.3 Thermal Information

THERMAL METRIC(1)

REF80

UNIT

NAJ (LCCC)

20 PINS

1s0p JEDEC

REF8EVM

RθJA

Junction-to-ambient thermal resistance

103.6

141.9

°C/W

RθJB

Junction-to-board thermal resistance

45.1

55.8

°C/W

ΨJT

Junction-to-top characterization parameter

38.3

39.2

°C/W

ΨJB

Junction-to-board characterization parameter

45.1

55.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

REF80

SNAS856A – SEPTEMBER 2024 – REVISED MARCH 2025

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