CF5019 series

SEIKO NPC CORPORATION —2

PAD LAYOUT

(Unit:

µm)

PIN DESCRIPTION and PAD DIMENSIONS

BLOCK DIAGRAM

Chip size: 0.9

× 1.05mm

Chip thickness: 220µm ± 30µm

PAD size: 90µm

Name

I/O

Description

Pad dimensions [µm]

XY

INHN

I

Output state control input. High impedance when LOW (oscillator stops).

Power-saving pull-up resistor built-in.

144.6

190.6

XT

I

Amplifier input

Crystal connection pins.

Crystal is connected between XT and XTN.

347.8

171

XTN

O

Amplifier output

560.6

171

VSS

–

(–) ground

755.4

497.8

Q

O

Output

755.4

905.4

VDD

–

(+) supply voltage

151.4

918.2

INHN = LOW active

Q

VDD

XTN

VSS

(0,0)

(900,1050)

X

Y

INHN

XT

NPC

XT

VSS

VDD

Q

XTN

INHN