TEWS TECHNOLOGIES GmbH keeps the right to change technical specification without further notice.

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Issue 1.0.1

2017-10-12

TEWS TECHNOLOGIES GmbH

Am Bahnhof 7

25469 Halstenbek, Germany

Phone: +49 (0) 4101 4058 0

Fax: +49 (0) 4101 4058 19

e-mail: info@tews.com

www.tews.com

The Embedded I/O Company

Technical Information

 Form Factor: PICMG AMC.0 R2.0Module

 Board size: 180.6 mm x 73.5 mm

 Single width

 Mid-Size or Full-Size front panel

 PCIe x1 port (AMC.1 Type 1 compliant)

 Optional connection to AMC port 0 & 1 (not for

XC6SLX25T)

 IPMI V1.5 support

 Front Panel LEDs:

 Blue Hot-Swap LED

 Red Power Good LED (LED1)

 Green FPGA DONE LED (LED2)

 Spartan-6 FPGA

 Xilinx XC6SLX25T/75T/100T/150T-2

 Flash device is programmable via JTAG



FPGA clock options:

 Programmable clock generator (5 KHz –

500 MHz), three clock outputs connected to

FPGA

 Two differential reference clocks from FMC slot

 2x DDR3 SDRAM bank, 64M x 16 (128 MB) each

 64 Mbit SPI-EEPROM

 VITA 57.1 FMC slot (low pin count)

 68 single-ended or 34 differential I/O lines

 2 differential reference clocks

 x1 multi-gigabit link

 VADJ = 1.2 – 3.3 Volt

 Operating temperature -40°C to +85°C

 MTBF (MIL-HDBK217F/FN2 GB 20°C)

TAMC631-xx: 260 000 h