4 Pin Configuration and Functions

Figure 4-1. DBZ Package, 3-Pin SOT-23 (Top View)

Table 4-1. Pin Functions

PIN

DESCRIPTION

NAME

NO.

AN1

1

Anode of diode 1

AN2

2

Anode of diode 2

CC

3

Common Cathode

5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

PPP

IEC 61643-321 Power (tp - 10/1000µs) at 25°C

20

W

IPP

IEC 61643-321 Current (tp - 10/1000µs) at 25°C

0.5

A

TA

Operating free-air temperature

-55

150

°C

TJ

Junction temperature

-55

150

Tstg

Storage temperature

-65

155

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

5.2 ESD Ratings—JEDEC Specification

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001 (1)

± 2500

V

Charged device model (CDM), per JEDEC

specification JS-002 (2)

± 1000

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard

ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard

ESD control process.

5.3 ESD Ratings—IEC Specification

VALUE

UNIT

V(ESD)

Electrostatic discharge

IEC 61000-4-2 Contact Discharge, all pins

±30000

V

IEC 61000-4-2 Air-gap Discharge, all pins

±30000

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MMBZ30VCL

SLVSIA0 – NOVEMBER 2024

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