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ADA4620-2ARZ-R7 Folha de dados(PDF) 10 Page - Analog Devices

Nome de Peças ADA4620-2ARZ-R7
Descrição Electrónicos  36 V, Precision, Low Noise, 16.5 MHz JFET Op Amp with Rail-to-Rail Output
PDF  49 Pages
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Fabricante Electrônico  AD [Analog Devices]
Página de início  http://www.analog.com
Logo AD - Analog Devices

ADA4620-2ARZ-R7 Folha de dados(HTML) 10 Page - Analog Devices

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Data Sheet
ADA4620-1, ADA4620-2
analog.com
Rev. 0
10 of 49
ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless otherwise specified.
Table 3. Absolute Maximum Ratings
PARAMETER
RATING
Supply Voltage ((V+) − (V−))
40 V
Input Voltage Single-Ended
(V−) − 0.3 V to (V+) + 0.3 V
Input Voltage Differential
((V+) − (V−)) + 0.6 V
Output Voltage (VOUT)
(V−) − 0.3 V to (V+) + 0.3 V
Input Current (I+IN, I−IN)
20 mA
Output Short-Circuit Duration1
Continuous
Storage Temperature
−65 °C to +150 °C
Operating Temperature
−40 °C to +125 °C
Junction Temperature
−65 °C to +150 °C
Lead Temperature Soldering, 10 s
300°C
.
1
A heatsink may be required to keep the TJ below the absolute maximum rating when the output is shorted
indefinitely.
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These
are stress ratings only, functional operation of the product at these or any other conditions above those indicated in
the operational section of this specification is not implied. Operation beyond the maximum operating conditions for
extended periods may affect product reliability.
Thermal Characteristics
Thermal performance is directly linked to the PCB design and operating environment. Close attention to PCB
thermal design is required.
JA is the junction-to-ambient thermal resistance.
JC is the junction-to-case thermal resistance.
Table 4. Thermal Resistance
Package Type
JA
JC
Unit
ADA4620-1
SOIC_N (R-8)
115.5
46.3
C/W
ADA4620-2
SOIC_N (R-8)
110.1
47.5
C/W
Maximum Power Dissipation
The maximum safe power dissipation in the ADA4620 SOIC-8 package is limited by the associated rise in junction
temperature (TJ) on the die. The plastic encapsulating the die locally reaches the junction temperature. At
approximately 150°C, which is the glass transition temperature, the plastic changes its properties. Even temporarily



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