Nexperia

BC56PAST series

80 V, 1 A NPN medium power transistors

9. Thermal characteristics

Table 7. Thermal characteristics

Tamb = 25 °C unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

[1]

-

-

235

K/W

Rth(j-a)

thermal resistance from junction to ambient

in free air

[2]

-

-

124

K/W

Rth(j-sp)

thermal resistance from junction to solder point

-

-

15

K/W

[1] Device mounted on an FR4 Printed-Circuit-Board (PCB); single-sided copper; tin-plated and standard footprint.

[2] Device mounted on an FR4 Printed-Circuit-Board (PCB); single-sided copper; tin-plated; mounting pad for collector 1 cm2.

aaa-040524

10

1

102

103

Zth(j-a)

(K/W)

10-1

10-5

10

10-2

10-4

102

10-1

tp (s)

10-3

103

1

0

duty cycle = 1

0.01

0.02

0.05

0.33

0.75

0.50

0.20

0.10

0.25

FR4 PCB; single-sided copper; tin-plated and standard footprint

Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

aaa-040525

10

1

102

103

Zth(j-a)

(K/W)

10-1

10-5

10

10-2

10-4

102

10-1

tp (s)

10-3

103

1

duty cycle = 1

0.01

0.02

0.05

0.33

0.75

0.50

0.20

0.10

0

0.25

FR4 PCB; single-sided copper; tin-plated; mounting pad for collector 1 cm2

Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

BC56PAST_SER

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Product data sheet

Rev. 1 — 23 August 2024

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