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ADL5545ARKZ-R7 Folha de dados(PDF) 13 Page - Analog Devices |
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ADL5545ARKZ-R7 Folha de dados(HTML) 13 Page - Analog Devices |
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13 / 18 page ![]() Data Sheet ADL5545 Rev. B | Page 13 of 18 40 35 0 5 10 15 20 25 30 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 5.8 6.0 FREQUENCY (GHz) GAIN, DEFAULT SETUP CONFIGURATION GAIN, HIGH FREQUENCY CONFIGURATION P1dB, DEFAULT SETUP CONFIGURATION P1dB, HIGH FREQUENCY CONFIGURATION NOISE FIGURE, DEFAULT SETUP CONFIGURATION NOISE FIGURE, HIGH FREQUENCY CONFIGURATION OIP3, DEFAULT SETUP CONFIGURATION OIP3, HIGH FREQUENCY CONFIGURATION Figure 32. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency, 4 GHz to 6 GHz, Comparison of Performance with the Optimized Settings and the Default Configuration 0 –5 –10 –15 –20 –35 –30 –25 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 5.8 6.0 FREQUENCY (GHz) S11, DEFAULT SETUP CONFIGURATION S12, DEFAULT SETUP CONFIGURATION S22, DEFAULT SETUP CONFIGURATION S11, HIGH FREQUENCY CONFIGURATION S12, HIGH FREQUENCY CONFIGURATION S22, HIGH FREQUENCY CONFIGURATION Figure 33. Return Loss and Reverse Isolation, 4 GHz to 6 GHz, Comparison of Performance with the Optimized Settings and the Default Configuration SOLDERING INFORMATION AND RECOMMENDED PCB LAND PATTERN Figure 34 shows the recommended land pattern for the ADL5545. To minimize thermal impedance, the exposed pad on the underside of the SOT-89 package is soldered to a ground plane, along with Pin 2. If multiple ground layers exist, stitch the layers together using vias. 1.50mm 3.00mm 1.27mm 0.62mm 3.48mm 1.80mm 0.86mm 5.37mm 0.20mm 0.762mm 0.635mm 0.86mm Figure 34. Recommended Land Pattern The land pattern on the ADL5545 evaluation board provides a measured thermal resistance (θJA) of 53°C/W. To measure θJA, the temperature at the top of the SOT-89 package is found with an IR temperature gun. Thermal simulation suggests a junction temperature 10°C higher than the top-of-package temperature. With additional measurements of the ambient temperature and I/O power, θJA can be determined. |
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