SSM2211_07 datasheet(5/24 Pages) AD

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SSM2211

Rev. D | Page 5 of 24

ABSOLUTE MAXIMUM RATINGS

Absolute maximum ratings apply at 25°C, unless otherwise noted.

Table 4.

Parameter

Rating

Supply Voltage

6 V

Input Voltage

VDD

Common-Mode Input Voltage

VDD

ESD Susceptibility

2000 V

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +85°C

Junction Temperature Range

−65°C to +165°C

Lead Temperature Range, Soldering (60 sec)

300°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 5. Thermal Resistance

Package Type

θJA

Unit

8-Lead LFCSP_VD (CP-Suffix)1

°C/W

8-Lead SOIC_N (S-Suffix)2

121

°C/W

1 For the LFCSP_VD, θJA is measured with exposed lead frame soldered to the

printed circuit board.

2 For the SOIC_N, θJA is measured with the device soldered to a 4-layer printed

circuit board.

ESD CAUTION

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