HMC1061LC5

Data Sheet

Rev. B | Page 18 of 18

OUTLINE DIMENSIONS

16

0.50

BSC

3.50 REF

BOTTOM VIEW

TOP VIEW

SIDE VIEW

1

32

9

17

24

25

8

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.36

0.30

0.24

EXPOSED

PAD

PIN 1

INDICATOR

5.05

4.90 SQ

4.75

4.10 BSC

1.10

1.00

0.90

3.60

3.50 SQ

3.40

PIN 1

0.32

BSC

0.08

BSC

SEATING

PLANE

Figure 28. 32-Terminal Ceramic Leadless Chip Carrier [LCC]

(E-32-1)

Dimensions shown in millimeters.

ORDERING GUIDE

Model1

Temperature Range

MSL Rating2

Package Description

Package Option

HMC1061LC5

−40°C to +85°C

MSL3

32-Terminal Ceramic Leadless Chip Carrier [LCC]

E-32-1

HMC1061LC5TR

−40°C to +85°C

MSL3

32-Terminal Ceramic Leadless Chip Carrier [LCC]

E-32-1

HMC1061LC5TR-R5

−40°C to +85°C

MSL3

32-Terminal Ceramic Leadless Chip Carrier [LCC]

E-32-1

EVAL01-HMC1061LC5

Evaluation Board

1

The HMC1061LC5, HMC1061LC5TR, and HMC1061LC5TR-R5 are RoHS Compliant Parts.

2

See the Absolute Maximum Ratings section.

©2018 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D15048-0-2/18(B)