ADIS16204SLASHPCBZ datasheet(21/24 Pages) AD

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ADIS16204

Rev. 0 | Page 21 of 24

SECOND-LEVEL ASSEMBLY

The ADIS16204 can be attached to the second-level assembly

board using SN63 (or equivalent) or a Pb-free solder. Figure 26

and Table 41 provide acceptable solder reflow profiles for each

solder type. Note that these profiles may not be the optimum

profile for the user’s application. In no case should 260°C be

exceeded. It is recommended that the user develop a reflow

profile based upon the specific application.

In general, keep in mind that the lowest peak temperature and

shortest dwell time above the melt temperature of the solder

results in less shock and stress to the product. In addition,

evaluating the cooling rate and peak temperature can result

in a more reliable assembly.

t25°C TO PEAK

PREHEAT

CRITICAL ZONE

TL TO TP

TIME

RAMP-DOWN

RAMP-UP

TSMIN

TSMAX

Figure 26. Acceptable Solder Reflow Profiles

Table 41. Acceptable Solder Reflow Profiles1

Condition

Profile Feature

Sn63/Pb37

Pb-Free

Average Ramp Rate (TL to TP)

3°C/sec max

Preheat

Minimum Temperature (TSMIN)

100°C

150°C

Maximum Temperature (TSMAX)

150°C

200°C

Time (TSMIN to TSMAX) (ts)

60 sec to 120 sec

60 sec to180 sec

TSMAX to TL

Ramp-Up Rate

3°C/sec

Time Maintained Above Liquidous Temperature(TL)

Liquidous Temperature (TL)

183°C

217°C

Time (tL)

60 sec to 150 sec

Peak Temperature (TP)

240°C + 0°C/–5°C

260°C + 0°C/–5°C

Time Within 5°C of Actual Tp

10 sec to 30 sec

20 sec to 40 sec

Ramp-Down Rate

6°C/sec max

Time 25°C to TP

6 min max

8 min max

1 Per IPC/JEDEC J-STD-020C.

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