Analog Integrated Circuit Device Data

Freescale Semiconductor

5

34713

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

THERMAL RESISTANCE (7)

Thermal Resistance, Junction to Ambient, Single-Layer Board (1s) (8)

139

°C/W

Thermal Resistance, Junction to Ambient, Four-Layer Board (2s2p) (9)

43

°C/W

Thermal Resistance, Junction to Board (10)

22

°C/W

Notes

7.

The PVIN, SW, and PGND pins comprise the main heat conduction paths.

8.

Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.

9.

Per JEDEC JESD51-6 with the board (JESD51-7) horizontal. There are no thermal vias connecting the package to the two planes in the

board.

10.

Thermal resistance between the device and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top

surface of the board near the package.

Table 2. Maximum Ratings (continued)

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings

Symbol

Value

Unit