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AS8579

Absolute Maximum Ratings

Datasheet

• PUBLIC

DS000707

• v4-01 • 2022-Jun-08

│ 8

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to

the device. These are stress ratings only. Functional operation of the device at these or any other

conditions beyond those indicated under “Operating Conditions” is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Figure 5

Absolute Maximum Ratings of AS8579

Symbol

Parameter

Min

Max

Unit

Comments

Electrical Parameters

VDD

DC Supply Voltage at VDD

-0.3

Non operational

VDC_ON

DC Voltage at Digital IO Pins

-0.3

VDD+0.3

VDC_SEN

Sensor Analog Pins

(SENx, VAR_SEN)

-0.3

ISCR

Input Current (latch-up

immunity)

±100

AEC-Q100-004

Electrostatic Discharge

ESD_HBM

Electrostatic Discharge HBM

±2

AEC-Q100-002

ESD_MM

Electrostatic Discharge MM

±100

AEC-Q100-003

ESD_CDM

Electrostatic Discharge CDM

±500

AEC-Q100-011

±750 V on corner

pins only

Temperature Ranges and Storage Conditions

TAMB

Operating Ambient

Temperature

-40

125

°C

TSTRG

Storage Temperature Range

-55

150

°C

TBODY

Package Body Temperature

260

°C

IPC/JEDEC J-STD-

020(1)

RHNC

Relative Humidity (non-

condensing)

MSL

Moisture Sensitivity Level

Represents a

maximum floor life

time of 168 hours

(1)

The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020

“Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices.” The lead finish for

Pb-

free leaded packages is “Matte Tin” (100 % Sn)

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