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PCF8535 Folha de dados(PDF) 49 Page - NXP Semiconductors |
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PCF8535 Folha de dados(HTML) 49 Page - NXP Semiconductors |
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49 / 52 page  1999 Aug 24 49 Philips Semiconductors Objective specification 65 × 133 pixel matrix driver PCF8535 16 TRAY INFORMATION handbook, full pagewidth MGS691 D C A x y F E B Fig.29 Tray details. The dimensions are given in Table 25. Table 25 Dimensions handbook, halfpage MGS692 Fig.30 Tray alignment. The orientation of the IC in a pocket is indicated by the position of the IC type name on the die surface with respect to the chamfer on the upper left corner of the tray. Refer to the bonding pad location diagram for the orientating and position of the type name on the die surface. DIM. DESCRIPTION VALUE A pocket pitch in x direction 14.88 mm B pocket pitch in y direction 4.06 mm C pocket width in x direction 12.76 mm D pocket width in y direction 2.46 mm E tray width in x direction 50.8 mm F tray width in y direction 50.8 mm x number of pockets in x direction 3 y number of pockets in y direction 11 |
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