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AM29F010B50DPC1 Folha de dados(PDF) 12 Page - Advanced Micro Devices |
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AM29F010B50DPC1 Folha de dados(HTML) 12 Page - Advanced Micro Devices |
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12 / 14 page ![]() 10 Am29F010B Known Good Die SU PP L E ME NT REVISION SUMMARY Revision A+1 (August 4, 2000) Physical Specifications Deleted Si from bond pad metalization specification. Revision A+2 (June 27, 2001) Added Penang, Malaysia, as a test facility (ACN 2016). Publication Number 23479 Revision A (October 23, 2003) Changed publication number for document. |
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