Specifications of the HT2 MOA3 S20

Rev. 1.1

1997-08-19

Ht2moa3.doc/HS

Page 2 of 22

Table of Contents

1 Definitions .............................................................................................................................. 3

1.1 Objective of the Specifications ..................................................................................................................... 3

1.2 Definition of the Chip Module ..................................................................................................................... 3

1.3 Use of the Modules ...................................................................................................................................... 3

2 Specifications ......................................................................................................................... 4

2.1 Mechanical Properties ................................................................................................................................. 4

2.2 Materials ..................................................................................................................................................... 4

2.3 Temperature Range ..................................................................................................................................... 4

2.4 Storage Conditions ...................................................................................................................................... 5

2.5 Delivery Conditions ..................................................................................................................................... 5

2.6 Electrical Specifications............................................................................................................................... 6

3 Drawing of the Chip Module HT2 MOA3 S20..................................................................... 7

3.1 Drawing of the Reel..................................................................................................................................... 7

3.2 Module outline suggestion ........................................................................................................................... 8

3.3 Splicing Specification .................................................................................................................................. 9

4 Coil Specifications................................................................................................................ 10

5 Functional Description of HITAG 2 ................................................................................... 12

5.1 Memory Organization................................................................................................................................ 12

5.2 Operation Modes and Configuration .......................................................................................................... 13

5.2.1 Modes of Operation............................................................................................................................ 13

5.2.2 Status Flow ........................................................................................................................................ 14

5.2.3 Configuration..................................................................................................................................... 15

5.3 Configuration of Delivered HITAG 2 Transponders................................................................................... 16

5.4 Definition of Passwords and Keys .............................................................................................................. 17

6 Quality Inspection ............................................................................................................... 18

7 Characterisation and Test of the Final Transponder ......................................................... 19

7.1 Characterisation of the Transponder .......................................................................................................... 19

7.2 Final Test of the Transponder .................................................................................................................... 19

8 Ordering Information.......................................................................................................... 20

HITAG