NLSF595

http://onsemi.com

13

PACKAGE DIMENSIONS

QFN−16

MN SUFFIX

CASE 485G−01

ISSUE B

16X

SEATING

PLANE

L

D

E

0.15 C

A

A1

e

D2

E2

b

1

4

58

12

9

16

13

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.25 AND 0.30 MM FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

MINIMUM SPACING BETWEEN LEAD TIP

AND FLAG

B

A

0.15 C

TOP VIEW

SIDE VIEW

BOTTOM VIEW

PIN 1

LOCATION

0.10 C

0.08 C

(A3)

C

16 X

e

16X

NOTE 5

0.10 C

0.05 C

A B

NOTE 3

K

16X

DIM

MIN

MAX

MILLIMETERS

A

0.80

1.00

A1

0.00

0.05

A3

0.20 REF

b

0.18

0.30

D

3.00 BSC

D2

1.65

1.85

E

3.00 BSC

E2

1.65

1.85

e

0.50 BSC

K

0.20

−−−

L

0.30

0.50

EXPOSED PAD

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

mm

inches

SCALE 10:1

0.50

0.02

0.575

0.022

1.50

0.059

3.25

0.128

0.30

0.012

3.25

0.128

0.30

0.012

EXPOSED PAD