OP177

Rev. E | Page 5 of 16

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Ratings

Supply Voltage

±22 V

Internal Power Dissipation1

500 mW

Differential Input Voltage

±30 V

Input Voltage

±22 V

Output Short-Circuit Duration

Indefinite

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature (Soldering, 60 sec)

300°C

−65°C to +150°C

equal to the supply voltage.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

device soldered to printed circuit board for SOIC package.

Table 4. Thermal Resistance

Package Type

Unit

8-Lead PDIP (P-Suffix)

103

43

°C/W

8-Lead SOIC (S-Suffix)

158

43

°C/W

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.