Data Sheet G10633EJ5V0DS

6

µ PC305

RECOMMENDED SOLDERING CONDITIONS

The

µ PC305 should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales

representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

Type of Surface Mount Device

µ PC305G2: 8-pin plastic SOP (5.72 mm (225) )

Process

Conditions

Symbol

Infrared reflow

Package peak temperature: 230

°C, time: 30 sec MAX. (210°C MIN.),

number of times: once

IR30-00-1

VPS

Package peak temperature: 215

°C, time: 40 sec MAX. (200°C MIN.),

number of times: once

VP15-00-1

Wave soldering

Solder bath temperature: 260

°C MAX., time: 10 sec MAX., number of times: once,

preheating temperature: 120

°C MAX. (package surface temperature)

WS60-00-1

Caution Do not use different soldering methods together (except for partial heating) .