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GWIXP425BCT Folha de dados(PDF) 50 Page - Intel Corporation

Nome de Peças GWIXP425BCT
Descrição Electrónicos  Intel짰 IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor
PDF  134 Pages
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Fabricante Electrônico  INTEL [Intel Corporation]
Página de início  http://www.intel.com
Logo INTEL - Intel Corporation

GWIXP425BCT Folha de dados(HTML) 50 Page - Intel Corporation

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Intel® IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor
March 2005
Datasheet
50
Document Number: 252479, Revision: 005
4.0
Package and Pinout Information
The Intel® IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor
have a 492-ball, plastic ball grid array (PBGA) package for commercial-temperature applications
and a pin-for-pin, compatible 492-ball, plastic ball grid array with a drop-in heat spreader (H) for
extended-temperature applications.
4.1
Package Description
Figure 7.
492-Pin Lead PBGA Package
1.
All measurements are in millimeters (mm).
2.
The size of the land pad at the interposer side (1) is 0.81 mm.
3.
The size of the solder resist at the interposer side (2) is 0.66 mm.
B1268-03
0.60 ± 0.10
Seating Plane
30º
3
1.17 ± 0.05
2.38 ± 0.21
0.61 ± 0.06
0.15
C
0.20
-C-
SIDE VIEW
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
AA
Y
W
U
T
23
22
21
20
19
18
17
16
24
25
26
V
AB
AC
AD
AE
AF
Pin #1
Corner
1.27
1.63 REF
1.27
A
C
ø 0.30
B S
ø1.0
3 Places
2
+ +
1.63 REF
0.90
0.60
ø
S
S
+
+
+
22.00 REF
22.00 REF
35.00 ± 0.20
35.00 ± 0.20
30.00 ± 0.25
Pin 1 ID
30.00 ± 0.25
45º Chamfer
4 Places
0.127 A
-B-
-A-
TOP VIEW
(1)
(2)



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