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ICS553MIT Folha de dados(PDF) 5 Page - Integrated Circuit Systems

Nome de Peças ICS553MIT
Descrição Electrónicos  LOW SKEW 1 TO 4 CLOCK BUFFER
PDF  6 Pages
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Fabricante Electrônico  ICST [Integrated Circuit Systems]
Página de início  http://www.icst.com
Logo ICST - Integrated Circuit Systems

ICS553MIT Folha de dados(HTML) 5 Page - Integrated Circuit Systems

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LOW SKEW 1 TO 4 CLOCK BUFFER
MDS 553 H
5
Revision 080404
In te gr ated Circuit Systems ● 525 Ra ce Street, San Jose, CA 9512 6 ● tel (4 08) 295-9 800 ● www.icst.com
ICS553
AC Electrical Characteristics
VDD = 2.5V ±5%, Ambient Temperature -40 to +85 °C, unless stated otherwise
VDD = 3.3V ±5%, Ambient Temperature -40 to +85 °C, unless stated otherwise
VDD = 5V ±5%, Ambient Temperature -40 to +85 °C, unless stated otherwise
Notes: 1. With rail to rail input clock
2. Between any 2 outputs with equal loading.
3. Duty cycle on outputs will match incoming clock duty cycle. Consult ICS for tight duty cycle clock
generators.
Thermal Characteristics
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Input Frequency
0
200
MHz
Output Rise Time
tOR
0.8 to 2.0V, CL=15pF
1.0
1.5
ns
Output Fall Time
tOF
2.0 to 0.8V, CL=15pF
1.0
1.5
ns
Propagation Delay
Note 1
2.2
3
5
ns
Output to output skew
Note 2
Rising edges at VDD/2
0
50
ps
Device to device skew
Rising edges at VDD/2
500
ps
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Input Frequency
0
200
MHz
Output Rise Time
tOR
0.8 to 2.0V, CL=15pF
0.6
1.0
ns
Output Fall Time
tOF
2.0 to 0.8V, CL=15pF
0.6
1.0
ns
Propagation Delay
Note 1
2.0
2.4
4
ns
Output to output skew
Note 2
Rising edges at VDD/2
0
50
ps
Device to device skew
Rising edges at VDD/2
500
ps
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Input Frequency
0
200
MHz
Output Rise Time
tOR
0.8 to 2.0V, CL=15pF
0.3
0.7
ns
Output Fall Time
tOF
2.0 to 0.8V, CL=15pF
0.3
0.7
ns
Propagation Delay
Note 1
1.8
2.5
4
ns
Output to output skew
Note 2
Rising edges at VDD/2
0
50
ps
Device to device skew
Rising edges at VDD/2
500
ps
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Thermal Resistance Junction to
Ambient
θ
JA
Still air
150
°C/W
θ
JA
1 m/s air flow
140
°C/W
θ
JA
3 m/s air flow
120
°C/W
Thermal Resistance Junction to Case
θ
JC
40
°C/W



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