August 1986

13

Philips Semiconductors

Product specification

HF/VHF power transistor

BLW77

The circuit and the components are situated on one side of the epoxy fibre-glass board, the other side being fully

metallized to serve as earth. Earth connections are made by means of hollow rivets, whilst under the emitter leads Cu

straps are used for a direct contact between upper and lower sheets.

Fig.17 Component layout and printed-circuit board for 87,5 MHz test circuit.

handbook, full pagewidth

MGP536

65

116

C1

C2

C3

C4

R1

C6

C5

C8

C9

C10

+VCC

R2

C7b

C7a

L4

L1

L6

L8

L7

L3

rivet

strip

L2

L5