1998 Jan 21

9

Philips Semiconductors

Product specification

UHF power MOS transistor

BLF544

Fig.12 Component layout for 500 MHz class-B test circuit.

The circuit and components are situated on one side of the printed circuit board, the other side being fully

metallized, to serve as a ground plane. Earth connections are made by means of copper straps and hollow rivets

for a direct contact between upper and lower sheets.

handbook, full pagewidth

+VD

150

70

C1

R3

C7

R2

R1

C2

C4

C10

C6

C11

C14

C17

L1

L2

L3

L4

L5

L6

L8

L9

C5

C8

C9

C15

C13

R5

C12

L7

C3

MDA501

C16

mounting screw

mounting screw

straps

straps

straps

rivets

straps

Dimensions in mm.