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AM26LS33AC Folha de dados(PDF) 13 Page - Texas Instruments

Nome de Peças AM26LS33AC
Descrição Electrónicos  AM26LS32Ax, AM26LS33Ax Quadruple Differential Line Receivers
PDF  36 Pages
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Fabricante Electrônico  TI [Texas Instruments]
Página de início  http://www.ti.com
Logo TI - Texas Instruments

AM26LS33AC Folha de dados(HTML) 13 Page - Texas Instruments

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Free-AirTemperature,T (
A °C)
I
= 440 A
OH
13
AM26LS32AC, AM26LS32AI, AM26LS32AM
AM26LS33AC, AM26LS33AM
www.ti.com
SLLS115F – OCTOBER 1980 – REVISED SEPTEMBER 2016
Product Folder Links: AM26LS32AC AM26LS32AM AM26LS33AM
Submit Documentation Feedback
Copyright © 1980–2016, Texas Instruments Incorporated
Typical Application (continued)
9.2.3 Application Curve
Figure 18. High-Level Output Voltage vs Free-Air Temperature
10 Power Supply Recommendations
Place 0.1-µF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high-
impedance power supplies.
11 Layout
11.1 Layout Guidelines
For best operational performance of the device, use good PCB layout practices including:
Noise can propagate into analog circuitry through the power pins of the circuit as a whole, as well as the
operational amplifier. Bypass capacitors are used to reduce the coupled noise by providing low impedance
power sources local to the analog circuitry.
Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as close
to the device as possible. A single bypass capacitor from V+ to ground is applicable for single supply
applications.
Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective
methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes.
A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital
and analog grounds, paying attention to the flow of the ground current.
To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If
it is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular as
opposed to in parallel with the noisy trace.
Place the external components as close to the device as possible. Keeping RF and RG close to the inverting
input minimizes parasitic capacitance.
Keep the length of input traces as short as possible. Always remember that the input traces are the most
sensitive part of the circuit.
Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce
leakage currents from nearby traces that are at different potentials.



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