ADV7393 datasheet(95/96 Pages) AD

95 / 96 page

ADV7390/ADV7391/ADV7392/ADV7393

Rev. 0 | Page 95 of 96

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

0.30

0.23

0.18

0.20 REF

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

12° MAX

1.00

0.85

0.80

SEATING

PLANE

COPLANARITY

0.08

0.50

0.40

0.30

3.50 REF

0.50

BSC

PIN 1

INDICATOR

TOP

VIEW

5.00

BSC SQ

4.75

BSC SQ

3.25

3.10 SQ

2.95

PIN 1

INDICATOR

0.60 MAX

0.25 MIN

EXPOSED

PAD

(BOTTOM VIEW)

EXPOSED PADDLE MUST BE SOLDERED

TO PCB GROUND FOR PROPER

HEAT DISSIPATION, NOISE IMMUNITY AND

MECHANICAL STRENGTH BENEFITS.

Figure 142. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

5 mm × 5 mm Body, Very Thin Quad

(CP-32-2)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2

4.25

4.10 SQ

3.95

TOP

VIEW

6.00

BSC SQ

PIN 1

INDICATOR

5.75

BCS SQ

12° MAX

0.30

0.23

0.18

0.20 REF

SEATING

PLANE

1.00

0.85

0.80

0.05 MAX

0.02 NOM

COPLANARITY

0.08

0.80 MAX

0.65 TYP

4.50

REF

0.50

0.40

0.30

0.50

BSC

PIN 1

INDICATOR

0.60 MAX

0.25 MIN

EXPOSED

PAD

(BOT TOM VIEW)

EXPOSED PADDLE MUST BE SOLDERED

TO PCB GROUND FOR PROPER

HEAT DISSIPATION, NOISE IMMUNITY AND

MECHANICAL STRENGTH BENEFITS.

Figure 143. 40-Lead Frame Chip Scale Package [LFCSP]

(CP-40)

Dimensions shown in millimeters

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