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MPC7448 Folha de dados(PDF) 30 Page - Freescale Semiconductor, Inc |
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MPC7448 Folha de dados(HTML) 30 Page - Freescale Semiconductor, Inc |
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30 / 60 page ![]() MPC7448 RISC Microprocessor Hardware Specifications, Rev. 3 30 Freescale Semiconductor Package Description 8.3 Package Parameters for the MPC7448, 360 HCTE LGA The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360 pin high coefficient of thermal expansion ceramic land grid array (HCTE). Package outline 25 × 25 mm Interconnects 360 (19 × 19 ball array – 1) Pitch 1.27 mm (50 mil) Minimum module height 1.52 mm Maximum module height 1.80 mm Pad diameter 0.89 mm (35 mil) Coefficient of thermal expansion12.3 ppm/°C |
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