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BAS82 Folha de dados(PDF) 2 Page - NXP Semiconductors

Nome de Peças BAS82
Descrição Electrónicos  Schottky barrier diodes
PDF  8 Pages
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Fabricante Electrônico  PHILIPS [NXP Semiconductors]
Página de início  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BAS82 Folha de dados(HTML) 2 Page - NXP Semiconductors

  BAS82 Datasheet HTML 1Page - NXP Semiconductors BAS82 Datasheet HTML 2Page - NXP Semiconductors BAS82 Datasheet HTML 3Page - NXP Semiconductors BAS82 Datasheet HTML 4Page - NXP Semiconductors BAS82 Datasheet HTML 5Page - NXP Semiconductors BAS82 Datasheet HTML 6Page - NXP Semiconductors BAS82 Datasheet HTML 7Page - NXP Semiconductors BAS82 Datasheet HTML 8Page - NXP Semiconductors  
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1998 Jun 24
2
Philips Semiconductors
Product specification
Schottky barrier diodes
BAS81; BAS82; BAS83
FEATURES
• Low forward voltage
• High breakdown voltage
• Guard ring protected
• Hermetically-sealed small SMD
package
• Low diode capacitance.
APPLICATIONS
• Ultra high-speed switching
• Voltage clamping
• Protection circuits
• Blocking diodes.
DESCRIPTION
Planar Schottky barrier diode with an
integrated protection ring against
static discharges. This surface
mounted diode is encapsulated in a
hermetically sealed SOD80C glass
SMD package with tin-plated metal
discs at each end. It is suitable for
“automatic placement” and as such it
can withstand immersion soldering.
Fig.1 Simplified outline (SOD80C), pin configuration and symbol.
handbook, halfpage
MAM190
ka
Cathode indicated by a grey band.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VR
continuous reverse voltage
BAS81
−
40
V
BAS82
−
50
V
BAS83
−
60
V
IF
continuous forward current
−
30
mA
IFRM
repetitive peak forward current
tp ≤ 1s; δ≤ 0.5
−
150
mA
IFSM
non-repetitive peak forward current
tp =1s
−
500
mA
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
−
125
°C



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