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HCTS393DMSR Folha de dados(PDF) 9 Page - Renesas Technology Corp |
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HCTS393DMSR Folha de dados(HTML) 9 Page - Renesas Technology Corp |
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9 / 9 page ![]() HCTS393MS FN3071 Rev 1.00 Page 9 of 9 August 1995 Die Characteristics DIE DIMENSIONS: 86 x 86 mils METALLIZATION: Type: AlSi Metal Thickness: 11k Å 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 m x 100m 4 mils x 4 mils Metallization Mask Layout HCTS393MS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCTS393 is TA14490A. Q0 1 (3) Q1 1 (4) (11) 2 Q0 (10) 2 Q1 NC NC |
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