HCS374MS

FN2470 Rev 3.00

Page 10 of 10

November 11, 2004

Die Characteristics

DIE DIMENSIONS:

108 x 106 mils

METALLIZATION:

Type: AlSi

Metal Thickness: 11k

Å 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13k

Å  2.6kÅ

WORST CASE CURRENT DENSITY:

< 2.0 x 105A/cm2

BOND PAD SIZE:

100

m x 100m

4 mils x 4 mils

Metallization Mask Layout

HCS374MS

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask

series for the HCS374 is TA14304B.

D1 (4)

Q1 (5)

Q2 (6)

D2 (7)

(8)

D3

(9)

Q3

(10)

GND

(11)

CP

(12)

Q4

(13)

D4

(18) D7

(17) D6

(16) Q6

(15) Q5

(14) D5

Q0

(2)

D0

(3)

OE

(1)

VCC

(20)

Q7

(19)