HCS373MS

FN2135 Rev 2.00

Page 10 of 10

September 1995

Die Characteristics

DIE DIMENSIONS:

2747 x 2693

m

METALLIZATION:

Type: SiAl

Metal Thickness: 11k

Å 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13k

Å  2.6kÅ

WORST CASE CURRENT DENSITY:

2.0 x 105A/cm2

BOND PAD SIZE:

100

m x 100m

4 x 4 mils

Metallization Mask Layout

HCS373MS

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask

series for the HCS373 is TA14303A.

OE

(1)

Q0

(2)

D1 (4)

Q1 (5)

D2 (7)

Q3

(9)

GND

(10)

Q4

(12)

(15) Q5

(16) Q6

(17) D6

(18) D7

Q7

(19)

VCC

(20)

(14) D5

D0

(3)

Q2 (6)

(8)

(11)

D4

(13)

D3

LE