PBLS2003D_2

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 02 — 27 August 2009

4 of 16

NXP Semiconductors

PBLS2003D

20 V PNP BISS loadswitch

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1cm2.

[3]

Device mounted on a ceramic PCB, Al2O3, standard footprint.

Table 6.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Per device

Rth(j-a)

thermal resistance from

junction to ambient

in free air

[1] -

-

315

K/W

[2] -

-

236

K/W

[3] -

-

210

K/W

FR4 PCB, standard footprint

Fig 2.

TR1 (PNP): Transient thermal impedance from junction to ambient as a function of pulse time; typical

values

0

006aaa415

10

1

102

103

Zth(j-a)

(K/W)

10−1

10−5

10

10−2

10−4

102

10−1

tp (s)

10−3

103

1

duty cycle =

1

0.75

0.5

0.33

0.2

0.1

0.05

0.02

0.01