VL53L8CXV0GCSLASH1 datasheet(34/42 Pages) STMICROELECTRONICS

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9.4

Tape outline drawing

Figure 32. VL53L8CX tape and reel packaging drawing

9.5

Pb-free solder reflow process

Table 22. Recommended solder profile and Figure 33. Solder profile show the recommended and maximum

values for the solder profile.

Customers have to tune the reflow profile depending on the PCB, solder paste, and material used. We expect

customers to follow the “recommended” reflow profile, which is specifically tuned for the VL53L8CX package.

For any reason, if a customer must perform a reflow profile, which is different from the “recommended” one

(especially where the peak temperature is > 240°C), the new profile must be qualified by the customer at their

own risk. The profile has to be within the “maximum” profile limit described in Table 22. Recommended solder

profile.

Table 22. Recommended solder profile

Parameters

Recommended

Maximum

Units

Minimum temperature (TS min)

Maximum temperature (TS max)

Time ts (TS min to TS max)

130

200

90-110

150

200

60-120

°C

Temperature (TL)

Time (tL)

Ramp up

217

55-65

217

55-65

°C

°C/s

Temperature (Tp-10)

Time (tp-10)

Ramp up

—

235

°C

°C/s

Peak temperature (Tp)

240

260

°C

Time to peak

300

Ramp down (peak to TL)

-4

-6

°C/s

VL53L8CX

Tape outline drawing

DS14161 - Rev 2

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