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STPS20M100S Folha de dados(PDF) 11 Page - STMicroelectronics |
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STPS20M100S Folha de dados(HTML) 11 Page - STMicroelectronics |
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11 / 15 page ![]() 2.4 D²PAK package information • Epoxy meets UL94, V0 • Cooling method: by conduction (C) Figure 13. D²PAK package outline Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. STPS20M100S D²PAK package information DS6169 - Rev 5 page 11/15 |
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