Copyright © 2004, ZMD AG, Rev. 1.6, 2005-05-19

15/19

All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior

written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.

ZMD31020

Sensor Signal Conditioner

Datasheet

4.

PACKAGE DIMENSIONS

All dimensions in mm, reference: DIN EN 190000

Dimensions of Sub-Group B1

1.99

0.25

0.38

0.65

7.65

7.90

0.63

1.22

SSOP14 (209mil = 5.3mm)

weight:

≤

0.3g

package body material: low stress epoxy

lead material:

FeNi-Alloy or Cu-Alloy

lead finish:

solder plating

lead form:

Z-bends

Dimensions of Sub-Group C1

1.73

0.05

0.21

1.68

1.78

0.09

0.20

6.07

6.33

5.20

5.38

0.25

θ

min

0°

θ

max

10°

* without mold-flesh