Computer On Modules

Features

Software APIs:

AMD EPYC™ 7003 Processor

COM-HPC® Server Size E module with

proprietary pinout

SOM-E780

ƒ

COM-HPC® Server Size E module with proprietary pinout

ƒ

Up to 64C/225W AMD EYPC™ 7003 real server grade CPU with extreme

performance

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Up to 512GB large memory size with 4x DDR4 long DIMM

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79 PCIe Gen4 lanes (14 more than COM-HPC STD)

ƒ

Supports iManager, Embedded Software APIs, WISE-DeviceOn, and IPMB

Specifications

Form Factor

Form Factor

COM-HPC® Size E

Pin-out Type

COM-HPC® Server (Proprietary Pinout)

Processor System

CPU

AMD EPYC 7003

Core Number

Up to 64C/128T

Socket Type

Socket SP3 (LGA 4094)

Platform Controller Hub

SOC

BIOS

AMI UEFI 128Mbit

Memory

Technology

DDR4

Frequency

3200MHz

ECC Support

Yes

Max. Capacity

512GB

Socket

1DPC, 4x RDIMM/LRDIMM sockets

PCI Express

4 PCIe x16, 64 lanes, Gen4 (Bitfurcate to x16, x8, x4)

14 PCIe x1, 14 lanes, Gen4, extra using for KR and RSVD signals (proprietary)

1 PCIe x1, Gen 4 for BMC (COM-HPC standard), total 79 PCIe lanes

Serial Bus

SMBus

1 (SOC or EC)

I2C Bus

1

Ethernet

Gigabit

Intel I225; 10M/100M/1000M/2.5Gbps

I/O

SATA3.0

2 Ports

USB 3.2 Gen1

4 Ports

USB 2.0

4 Ports

SPI Bus

1 port

GPIO

12-bits GPIO

LPC

1

Watchdog

65536 level, 0 ~ 65535 sec

COM Port

2 Ports (2-Wire)

TPM

TPM2.0

Smart Fan

2 Ports: 1 port on COM-HPC® module (4 pins); 1 port on carrier board (3 pins)

Power

Type

ATX: Vin, VSB; AT: Vin

Supply Voltage

Vin: 12V (± 5%); VSB: 5V (± 5%), RTC Battery: 2.0V ~ 3.3V

Power Consumption (Max.)

TBD

Power Consumption (Idle)

TBD

Environment

Temperature

Operating Standard: 0 ~ 60 °C (32 ~ 140 °F)

Storage: 0 ~ 60 °C (32 ~ 140 °F)

Humidity

Operating: 40 °C @ 95% relative humidity, non-condensing

Storage: 60 °C @ 95% relative humidity, non-condensing

Vibration Resistance

3.5G, 5~500Hz X/Y/Z Axis

Mechanical

Dimensions

200 x 160 mm

All product specifications are subject to change without notice.

Last updated: 15-Jun-2022