Computer On Modules

Features

SOM-D580

Specifications

Form Factor

Form Factor

COM-HPC® Size D

Pin-out Type

COM-HPC® Server

Processor System

CPU

D-2796TE

D-2775TE

D-2752TER

D-2733NT

D-2712T

Base Frequency

2.0 GHz

2.0 GHz

1.8 GHz

2.1 GHz

1.9 GHz

Max Turbo Frequency

3.1 GHz

3.1 GHz

2.8 GHz

3.2 GHz

3.0 GHz

Core

20

16

12

8

4

LLC

30MB

25MB

20MB

15MB

15MB

TDP

118W

100W

77W

80W

65W

BIOS

AMI UEFI 256Mbit

Memory

Technology

DDR4

Frequency

2933MHz/2667MHz

ECC Support

Yes

Max. Capacity

512GB

Socket

1DPC, 4x RDIMM, LRDIMM socket

PCI Express

2 PCIe x16, 32 lanes, Gen 4 (Bifurcate to x16, x8, x4, x2, x1)

2 PCIe x8, 16 lanes, Gen 3 (Bifurcate to x8, x4, x2, x1)

Serial Bus

SMBus

Yes

I2C Bus

x2

Ethernet

Ethernet KR

Intel Integrated 8x 10G or 4x 25G (depands on SoC SKU)

Gigabit

Intel I225; 10M/100M/1000M/2.5Gbps

I/O

SATA3.0

2 Ports

USB 3.2 Gen1

4 Ports

USB2.0

4 Ports

SPI Bus

Yes

GPIO

12-bit GPIO

eSPI

Yes

Watchdog

65536 level, 0 ~ 65535 sec

COM Port

2 Ports (2-Wire)

TPM

TPM2.0 (Optional)

Smart Fan

2 Ports: 1 port on COM module (4 pins); 1 port on carrier board (3 pins)

Power

Type

ATX: Vin, VSB; AT: Vin

Supply Voltage

Vin: 12V (± 5%); VSB: 5V (± 5%), RTC Battery: 2.0V ~ 3.3V

Power Consumption (Max.)

TBD

Power Consumption (Idle)

TBD

Environment

Operating Temperature

Standard: 0 ~ 60 °C (32 ~ 140 °F)

Extend: -40 ~ 85 °C (-40 ~ 185 °F)

Storage Temperature

-40 ~ 85 °C (-40 ~ 185 °F)

Humidity

Operating: 40 °C @ 95% relative humidity, non-condensing

Storage: 60 °C @ 95% relative humidity, non-condensing

Vibration Resistance

3.5G, 5~500Hz X/Y/Z Axis

Mechanical

Dimensions

160 x 160 mm

Intel® Xeon® D-2700 Processor

(Ice Lake-D HCC)

COM-HPC® Server Size D

ƒ

COM-HPC® Server Size D Module

ƒ

Intel® Xeon® D-2700 processors (Ice Lake-D HCC)

ƒ

Up to 20 Cores, 30MB LLC Cache, 118W TDP

ƒ

Quad channel DDR4-3200 RDIMM/LRDIMM up to 512GB

(Both ECC & Non-ECC)

ƒ

32 x PCIe Gen 4, 17 x PCIe Gen 3, 4 x 25GBASE-KR, IPMB

ƒ

Supports iManager, Embedded Software APIs, and WISE-DeviceOn

Preliminary

Software APIs:

All product specifications are subject to change without notice.

Last updated: 17-Aug-2022