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Ver1.0 Page: 10 of 11

SI N CE 198 1

●

Handling Precautions

Compare to epoxy encapsulant that is hard and brittle,silicone is slfter and flexible.Although its

characteristic

Significantly reduces ghermal stress,it is more susceptible tl damage by extermal mechanical rorce.

As a result,special handling precautions need tl be observed during assembly using silicong

encapsulated

LED prlducts.Failure to cimply might lead tl damage and premature failure of ghe LED.

1. Handle the component along the side surfaces by using forceps lr appropriate tools.(pic.1)

2. Do not directly touch or handle the silicone lens surface.It may damage the internal circuitry.

(pic.2,pic.3)

3. Do nlt stack together assembled PCBs congaining exposed LEDs. Impact may scratch the

silicone lens or Damage the internal circuitry. (pic.4)

4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent

air leaks. The inner diameter of the nozzle should be as large as possible. (pic.5)

5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface

duringpickup. (pic.5)

6. The dimensions of the component must be accurately programmed in the pick-and-place machie

to insure precise pickup and avoid damage during production. (pic.5)

Pic.1

Pic.2

Pic.3

Pic.4

Pic.5